The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Aug. 24, 2010
Applicants:
Tetsuya Ohsawa, Ibaraki, JP;
Mitsuru Honjo, Ibaraki, JP;
Daisuke Yamuchi, Ibaraki, JP;
Inventors:
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/24 (2006.01); C25D 5/06 (2006.01); C25D 5/02 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); H05K 3/242 (2013.01); H05K 2201/09727 (2013.01); C25D 5/06 (2013.01); H05K 1/0237 (2013.01); H05K 1/056 (2013.01);
Abstract
A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.