The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Nov. 24, 2010
Tomomichi Kanda, Niigata, JP;
Minoru Kikuchi, Niigata, JP;
Katsumi Shinohara, Niigata, JP;
Hideyuki Kurose, Niigata, JP;
Tomomichi Kanda, Niigata, JP;
Minoru Kikuchi, Niigata, JP;
Katsumi Shinohara, Niigata, JP;
Hideyuki Kurose, Niigata, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
A copolyamide resin for molding including a diamine component which includes two or more diamines and a dicarboxylic acid component. The diamine component includes 70 mol % or more of a xylylenediamine which includes 20 mol % or more of p-xylylenediamine and the dicarboxylic acid component includes 70 mol % or more of a straight-chain aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The copolyamide resin contains particles having a major diameter of 50 μm or more in an amount of 1000 particles/g or less, the particles being made of a polyamide having a melting point higher than that of the copolyamide resin by 20° C. or more when measured by a differential scanning calorimetry. The copolyamide resin has very uniform and stable properties and is excellent in any of mechanical properties, heat resistance, chemical and physical properties, and molding properties. An efficient production method of the copolyamide resin, its resin composition, and its molded article are also described.