The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Feb. 15, 2011
Stephan Hermes, Bad Dürkheim, DE;
Sorin Ivanovici, Heidelberg, DE;
Stephan Hermes, Bad Dürkheim, DE;
Sorin Ivanovici, Heidelberg, DE;
BASF SE, Ludwigshafen, DE;
Abstract
The invention relates to a composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate, comprising 0.1 to 6% by weight of electrolessly and/or electrolytically coatable particles, 40 to 98.8% by weight of at least one solvent, 0 to 15% by weight of a crosslinker, 0.1 to 6% by weight of at least one dispersing additive, 0 to 5% by weight of at least one further additive and 1 to 20% by weight of at least one polymer, said at least one polymer being in the form of a dispersion. The invention further relates to a process for producing full-area or structured metallic surfaces on a substrate, and to a use of the process.