The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Sep. 14, 2012
Applicants:

Young June Park, Seoul, KR;

Seok Ha Lee, Asan-si, KR;

Jun Ho Chun, Seoul, KR;

Yeonkyu Choi, Seoul, KR;

Inventors:

Young June Park, Seoul, KR;

Seok Ha Lee, Asan-si, KR;

Jun Ho Chun, Seoul, KR;

Yeonkyu Choi, Seoul, KR;

Assignee:

SNU R&DB Foundation, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/3205 (2006.01); C25D 5/00 (2006.01); C25D 7/12 (2006.01); C25D 3/02 (2006.01); H01L 21/208 (2006.01);
U.S. Cl.
CPC ...
H01L 21/208 (2013.01); C25D 3/02 (2013.01);
Abstract

A method of forming a channel layer of an electric device according to an embodiment is provided. First, a conductive substrate including an insulating layer on the substrate is provided. The conductive substrate and a metal to be plated are used as respective electrodes to carry out electroplating within an electrolyte solution. In this case, electrons provided by a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer.


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