The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Mar. 24, 2011
Applicants:

John A. Rogers, Champaign, IL (US);

Ralph G. Nuzzo, Champaign, IL (US);

Matthew Meitl, Raleigh, NC (US);

Heung Cho Ko, Urbana, IL (US);

Jongseung Yoon, Urbana, IL (US);

Etienne Menard, Durham, NC (US);

Alfred J. Baca, Urbana, IL (US);

Inventors:

John A. Rogers, Champaign, IL (US);

Ralph G. Nuzzo, Champaign, IL (US);

Matthew Meitl, Raleigh, NC (US);

Heung Cho Ko, Urbana, IL (US);

Jongseung Yoon, Urbana, IL (US);

Etienne Menard, Durham, NC (US);

Alfred J. Baca, Urbana, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/302 (2006.01); H01L 21/469 (2006.01); B82Y 10/00 (2011.01); B82Y 20/00 (2011.01); H01L 29/15 (2006.01); H01L 31/0687 (2012.01); H01L 31/0725 (2012.01); B81C 1/00 (2006.01); H01L 29/20 (2006.01); H01L 21/78 (2006.01); H01L 31/072 (2012.01); H01L 31/068 (2012.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 29/20 (2013.01); H01L 33/0079 (2013.01); Y02E 10/547 (2013.01); B82Y 10/00 (2013.01); B82Y 20/00 (2013.01); H01L 29/155 (2013.01); H01L 31/0687 (2013.01); Y02E 10/544 (2013.01); H01L 31/0725 (2013.01); B81C 1/0046 (2013.01); B81C 2201/0191 (2013.01); H01L 21/7813 (2013.01); H01L 31/072 (2013.01); H01L 31/068 (2013.01);
Abstract

Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.


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