The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Nov. 06, 2009
Yoshihiro Tomura, Osaka, JP;
Kazumichi Shimizu, Osaka, JP;
Kentaro Kumazawa, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor chip () is flip-chip mounted on a circuit board () with an underfill resin () interposed between the semiconductor chip () and the circuit board () and a container covering the semiconductor chip () is bonded on the circuit board (). At this point, the semiconductor chip () positioned with the underfill resin () interposed between the circuit board () and the semiconductor chip () is pressed and heated by a pressure-bonding tool (); meanwhile, the surface of the underfill resin () protruding around the semiconductor chip () is pressed by the pressure-bonding tool () through a film () on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness () is formed. The inner surface of the container covering the semiconductor chip () is bonded to the surface unevenness () on the surface of the underfill resin.