The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Jun. 13, 2011
Takanobu Akiyama, Shizuoka, JP;
Takanobu Akiyama, Shizuoka, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention provides a dicing method that achieves excellent dicing properties at low costs by removing a metal film through a metal processing operation with a diamond tool and then performing pulse laser beam irradiation. The dicing method is a method of dicing a substrate to be processed, devices being formed in the substrate to be processed, a metal film being formed on one surface of the substrate to be processed. The dicing method includes: placing the substrate to be processed onto a first stage; forming a groove portion by removing the metal film through a metal processing operation with a diamond tool; placing the substrate to be processed onto a second stage; generating a clock signal; emitting a pulse laser beam synchronized with the clock signal to the groove portion of the substrate to be processed; moving the substrate to be processed and the pulse laser beam relative to each other; switching the pulse laser beam between irradiation and non-irradiation of the substrate to be processed on a light pulse basis by controlling passing and blocking of the pulse laser beam with a pulse picker in synchronization with the clock signal; and forming cracks in the substrate to be processed, the cracks reaching the substrate surface.