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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8895160 B1

PDFFull Text
Date of Patent:
Nov. 25, 2014

Filed:

Sep. 29, 2008

Product and method for its manufacture within material processing

Applicants:

Ragnhild Mihic, Galve, SE;

Peter Mihic, Galve, SE;

Inventors:

Ragnhild Mihic, Galve, SE;

Peter Mihic, Galve, SE;

Assignee:

Mircona AB, Gavle, SE;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Gwendolyn Blackwell

Assistant Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 9/04 (2006.01); B32B 15/04 (2006.01); C01C 3/00 (2006.01); C01B 31/30 (2006.01); B23Q 11/00 (2006.01); B25D 17/00 (2006.01); C23C 14/06 (2006.01); B23B 27/00 (2006.01); B23B 29/04 (2006.01); B23B 31/00 (2006.01); C23C 14/00 (2006.01); C23C 16/34 (2006.01); C23C 28/02 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0658 (2013.01); B23B 27/002 (2013.01); B23B 27/007 (2013.01); B23B 29/043 (2013.01); B23B 31/005 (2013.01); C23C 14/0057 (2013.01); C23C 16/347 (2013.01); C23C 28/023 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); C23C 28/347 (2013.01); C23C 28/42 (2013.01); B23B 2226/18 (2013.01); B23B 2228/10 (2013.01); Y10S 428/9088 (2013.01);
Abstract

The present invention provides an appliance for chip removal applications comprising a vibration-damping material wherein the vibration-damping material is a material arranged by nano-dimensional cluster form. The present invention additionally provides a method for manufacturing said appliance. The present invention provides also an appliance obtainable by said method. Additionally the present invention provides an article or work piece for use in an appliance for chip removal applications. Also a computer program is provided for controlling the above method.

Find Patent Forward Citations

Mihic, Ragnhild. (2014). Product and method for its manufacture within material processing (U.S. Patent No. 8895160). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8895160

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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