The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Oct. 12, 2011
Applicants:

Cheng-chi Yeh, New Taipei, TW;

Nan-hung Lin, New Taipei, TW;

Andrew Cheng, New Taipei, TW;

Chih-pi Cheng, New Taipei, TW;

Shuo-hsiu Hsu, New Taipei, TW;

Ting-yao Hung, New Taipei, TW;

Inventors:

Cheng-Chi Yeh, New Taipei, TW;

Nan-Hung Lin, New Taipei, TW;

Andrew Cheng, New Taipei, TW;

Chih-Pi Cheng, New Taipei, TW;

Shuo-Hsiu Hsu, New Taipei, TW;

Ting-Yao Hung, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/57 (2011.01); H01R 4/02 (2006.01); H05K 3/34 (2006.01); H05K 7/10 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 4/024 (2013.01); H01R 12/716 (2013.01); H01R 13/2442 (2013.01); H01R 43/0256 (2013.01); H05K 3/3426 (2013.01); H05K 7/1069 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/041 (2013.01);
Abstract

An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.


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