The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Feb. 19, 2010
Applicants:

Yoshinobu Suehiro, Aichi-ken, JP;

Koji Tasumi, Aichi-ken, JP;

Inventors:

Yoshinobu Suehiro, Aichi-ken, JP;

Koji Tasumi, Aichi-ken, JP;

Assignee:

Toyoda Gosei Co., Ltd., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21S 8/10 (2006.01); F21S 4/00 (2006.01); F21V 7/00 (2006.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01);
U.S. Cl.
CPC ...
F21V 29/004 (2013.01); F21Y 2101/02 (2013.01); F21V 29/225 (2013.01); F21S 48/328 (2013.01); F21V 29/2243 (2013.01); F21Y 2103/003 (2013.01); F21S 4/008 (2013.01); F21V 7/005 (2013.01); F21V 29/2262 (2013.01); Y10S 362/80 (2013.01);
Abstract

A light-emitting device includes a light emitting portion including a substrate having a mounting surface for mounting an LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate including a ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member including one of aluminum, an aluminum alloy, magnesium, and a magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material.


Find Patent Forward Citations

Loading…