The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Apr. 26, 2011
Applicants:

Tomonori Itoh, Kyoto, JP;

Kaori Toyoda, Hyogo, JP;

Hiroki Ikeuchi, Osaka, JP;

Takeshi Kawabata, Osaka, JP;

Inventors:

Tomonori Itoh, Kyoto, JP;

Kaori Toyoda, Hyogo, JP;

Hiroki Ikeuchi, Osaka, JP;

Takeshi Kawabata, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/753 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75801 (2013.01); H01L 2224/75821 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2933/0033 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01055 (2013.01);
Abstract

When bump electrodesof a semiconductor light-emitting elementand electrode portionsof a mounting boardare joined to each other, power is supplied to the electrode portionsof the mounting boardto allow the semiconductor light-emitting elementto emit light, the optical properties of the semiconductor light-emitting elementhaving emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodesof the semiconductor light-emitting elementand the electrode portionsof the mounting board, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.


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