The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Mar. 13, 2012
Applicant:
Fong Shi, Bellevue, WA (US);
Inventor:
Fong Shi, Bellevue, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method and apparatus for joining a first workpiece and a second workpiece. A layer of exothermic material is placed between the first workpiece and the second workpiece. A plurality of currents is applied to the layer of exothermic material in a plurality of locations and substantially at the same time such that an exothermic reaction occurs in the layer of exothermic material.
Shi, Fong. (2014). Method of bonding components to each other using exothermic reactions (U.S. Patent No. 8893361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8893361
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile