The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Sep. 16, 2010
Yuuki Saitou, Komaki, JP;
Masaru Murayama, Komaki, JP;
Tomonori Hayakawa, Komaki, JP;
Koichi Hasegawa, Komaki, JP;
Tetsuyoshi Shibata, Komaki, JP;
Yuuki Saitou, Komaki, JP;
Masaru Murayama, Komaki, JP;
Tomonori Hayakawa, Komaki, JP;
Koichi Hasegawa, Komaki, JP;
Tetsuyoshi Shibata, Komaki, JP;
Tokai Rubber Industries, Ltd, Aichi-ken, JP;
Abstract
Provided are a bending sensor that is less dependent on an input speed of a strain and in which a response delay is unlikely to occur, and a deformed shape measurement method using the bending sensor. The bending sensor is configured to include a base material; a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles filled in the matrix resin at a filling rate of 30% by volume or more, and in which three-dimensional conductive paths are formed by contact among the conductive filler particles, and electrical resistance increases as an deformation amount increases; an elastically deformable cover film arranged so as to cover the sensor body; and a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances. In the sensor body, cracks are formed in advance in such a direction that the conductive paths are cut off during a bending deformation.