The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
May. 18, 2006
Applicant:
Prashant Singh, Eden Prairie, MN (US);
Inventor:
Prashant Singh, Eden Prairie, MN (US);
Assignee:
LSI Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H05K 1/02 (2006.01); H01L 23/66 (2006.01); H01P 5/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H03H 7/38 (2013.01); H01L 23/66 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3011 (2013.01); H01P 5/02 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/049 (2013.01); H01L 24/48 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/48599 (2013.01);
Abstract
An apparatus, system and method are described for impedance matching between a semiconductor package and a load on a board. In one embodiment of the present invention, a package trace is provided with an array of stubs that is designed to provide capacitance to the trace in order to more effectively match a wirebond. This improved match results in improvements in return loss, especially in higher speed applications such as broadband. Design parameters such as the width and length of each stub, and the spacing between the stubs may be varied depending on the impedance requirements of the trace.