The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Feb. 03, 2012
Applicant:
Suguru Sasaki, Kanagawa, JP;
Inventor:
Suguru Sasaki, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kawasaki-Shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 23/495 (2006.01); G01R 31/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 24/50 (2013.01); H01L 2924/01005 (2013.01);
Abstract
A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut.