The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Sep. 27, 2006
Applicant:

Edward B. Harris, Fogelsville, PA (US);

Inventor:

Edward B. Harris, Fogelsville, PA (US);

Assignee:

Agere Systems, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/525 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/525 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/5444 (2013.01);
Abstract

A chip and a method of fabricating the chip for low cost chip identification circuitry. In one embodiment, a method of manufacturing an integrated circuit includes formation of a multi-level metallization structure including a pad level comprising programming pads. A plurality of active devices are formed on a substrate, and multiple levels of metallization are formed over the active devices, connecting some of the active devices to form programmable circuitry. The programmable circuitry is connected to pairs of programming pads on the bond pad level. Programming pads in some of the pairs are selectively connected to one another by using conductive ink deposited with maskless inkjet printing techniques. The pads are then covered with a non-conductive protective layer.


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