The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Dec. 18, 2013
Panasonic Corporation, Osaka, JP;
Kenji Yokoyama, Kyoto, JP;
Takeshi Kawabata, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device includes: on an upper surface of a second semiconductor chip on a circuit board, a ring dam section formed at an outer circumference of a mounting region above which a first semiconductor chip is mounted; and an interconnect extending from the dam section to a center section of the first semiconductor chip or the second semiconductor chip in a region in which the first semiconductor chip faces the second semiconductor chip. The interconnect is electrically connected to a connection terminal on a circuit formation surface of the first or second semiconductor chip at the center section of the first or second semiconductor chip. The dam section and the interconnect are power supply interconnects or ground interconnects.