The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Apr. 26, 2013
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Cristiano Gianluca Stella, San Gregorio di Catania, IT;

Gaetano Pignataro, Trecastagni, IT;

Maurizio Maria Ferrara, Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/49562 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48091 (2013.01); H01L 23/49575 (2013.01); H01L 23/4334 (2013.01); H01L 2924/13055 (2013.01);
Abstract

An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.


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