The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Feb. 25, 2013
Applicant:

Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;

Inventors:

Shinsuke Nishi, Kariya, JP;

Shogo Mori, Kariya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/46 (2006.01); H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H02M 7/003 (2013.01); H01L 24/34 (2013.01); H01L 25/072 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01);
Abstract

A power conversion device is provided with a plurality of semiconductor modules. Each semiconductor module includes a heat dissipation member, an insulating substrate, a semiconductor element, an external connection terminal, and a resin portion. The insulating substrate is fixed to the heat dissipation member. The semiconductor element is mounted on the insulating substrate. The external connection terminal includes a first end, which is electrically connected to the semiconductor element, and an opposite second end. The resin portion is molded to the insulating substrate, the semiconductor element, the first end, and at least part of the heat dissipation member. The semiconductor modules each form a unit.


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