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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8890285 B1

PDFFull Text
Date of Patent:
Nov. 18, 2014

Filed:

Sep. 30, 2013

Vertically integrated systems

Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Alan J. O'Donnell, Castletroy, IE;

Santiago Iriarte, Dooradoyle, IE;

Mark J. Murphy, Kilmore, IE;

Colin G. Lyden, Baltimore, IE;

Gary Casey, Prospect, IE;

Eoin Edward English, Pallasgreen, IE;

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Mamadou Diallo

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 49/02 (2006.01); G01N 27/414 (2006.01); H01L 25/16 (2006.01); H01L 23/48 (2006.01); B81B 7/00 (2006.01); G01N 27/26 (2006.01); H01L 27/15 (2006.01); H01L 31/0392 (2006.01); H02S 10/10 (2014.01); H01L 31/053 (2014.01); H01F 17/00 (2006.01); H01L 21/82 (2006.01); H01L 27/06 (2006.01); H01L 23/367 (2006.01); H01L 23/38 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
G01N 27/4148 (2013.01); H01L 25/16 (2013.01); H01L 23/481 (2013.01); B81B 7/00 (2013.01); G01N 27/26 (2013.01); H01L 25/167 (2013.01); H01L 27/14 (2013.01); H01L 27/15 (2013.01); H01L 28/00 (2013.01); H01L 31/0392 (2013.01); H01L 31/0583 (2013.01); H01L 31/0586 (2013.01); H01F 17/00 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01); H01L 28/82 (2013.01); H01L 28/86 (2013.01); H01L 28/90 (2013.01); H01L 21/82 (2013.01); H01L 27/0694 (2013.01); H01L 2924/09701 (2013.01); H01L 2224/0557 (2013.01); H01L 2924/19104 (2013.01); H01L 23/3677 (2013.01); H01L 23/38 (2013.01); H01L 23/473 (2013.01); H01L 2924/10253 (2013.01); Y02E 10/50 (2013.01);
Abstract

Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

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