The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Jul. 03, 2013
Applicant:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventor:

Laurent-Luc Chapelon, Domene, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/058 (2006.01); H01L 27/04 (2006.01); H01L 21/66 (2006.01); G01K 5/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/04 (2013.01); H01L 2224/80141 (2013.01); H01L 24/05 (2013.01); H01L 2224/80896 (2013.01); H01L 22/34 (2013.01); H01L 2224/08147 (2013.01); H01L 24/08 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80357 (2013.01); G01K 5/56 (2013.01); H01L 24/80 (2013.01); H01L 2224/08111 (2013.01); H01L 2224/08057 (2013.01); H01L 2224/80012 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/80097 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/05546 (2013.01);
Abstract

A three-dimensional integrated structure is formed from a first integrated circuit with a first cavity filled with a first conductive material and a second integrated circuit with a second cavity filled with a second conductive material, the second cavity facing the first cavity. The filled first cavity forms a first element and the filled second cavity forms a second element, the first and second elements separated from each other by a cavity. The first and second conductive materials have different thermal expansion coefficients. A contact detection circuit is electrically connected to the filled first and second cavities, and is operable to sense electrical contact between the first and second conductive materials in response to a change in temperature.


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