The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Aug. 29, 2012
Naoto Kuratani, Kameoka, JP;
Naoto Kuratani, Kameoka, JP;
OMRON Corporation, Kyoto-Shi, JP;
Abstract
A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on the upper surface of the substrate. The microphone chip is connected to a pad on the lower surface of the cover by a bonding wire. The circuit element is connected to a pad on the upper surface of the substrate by a bonding wire. A cover-side joining portion in conduction with the pad on the lower surface of the cover, and a substrate-side joining portion in conduction with the pad on the upper surface of the substrate, are joined by a conductive material. A conductive layer for electromagnetic shielding is embedded inside the cover near the bonding pad and the cover-side joining portion.