The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Nov. 21, 2008
Applicants:

Myoung-jae Lee, Suwon-si, KR;

Young-soo Park, Yongin-si, KR;

Chang-bum Lee, Seoul, KR;

Seung-eon Ahn, Suwon-si, KR;

Ki-hwan Kim, Anyang-si, KR;

Bo-soo Kang, Seoul, KR;

Inventors:

Myoung-jae Lee, Suwon-si, KR;

Young-soo Park, Yongin-si, KR;

Chang-bum Lee, Seoul, KR;

Seung-eon Ahn, Suwon-si, KR;

Ki-hwan Kim, Anyang-si, KR;

Bo-soo Kang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 23/498 (2006.01); G11C 5/02 (2006.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); G11C 5/02 (2013.01); G11C 5/04 (2013.01); G11C 5/063 (2013.01); H01L 23/481 (2013.01); H01L 25/18 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes: a memory array on a first substrate; and a peripheral circuit on a second substrate, wherein the first substrate and the second substrate may be attached to each other so that the memory array and the peripheral circuit are electrically connected to each other.


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