The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Jul. 21, 2010
Applicants:
Naoki Uchiyama, Hamamatsu, JP;
Daisuke Kawaguchi, Hamamatsu, JP;
Hideki Shimoi, Hamamatsu, JP;
Inventors:
Assignee:
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/40 (2014.01); C03B 33/07 (2006.01); H01L 21/78 (2006.01); B28D 5/00 (2006.01); C03B 33/02 (2006.01);
U.S. Cl.
CPC ...
B28D 5/00 (2013.01); B23K 26/4075 (2013.01); B23K 26/0057 (2013.01); C03B 33/07 (2013.01); H01L 21/78 (2013.01); B23K 2201/40 (2013.01); C03B 33/0222 (2013.01);
Abstract
A rear faceof an object to be processedA and a front faceof an object to be processed for separationA are bonded to each other by anode bonding, whereby a fracturegenerated in a thickness direction of the object for separationA from a molten processed regionacting as a start point reaches a front faceof the objectA continuously without substantially changing its direction. Then, after cutting the objectsA,A, the objectA is removed from the objectA, so as to yield chips