The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Jan. 23, 2009
Applicants:
Yasushi Takamatsu, Funabashi, JP;
Yugo Yamamoto, Chiba, JP;
Yuichi Ito, Ichihara, JP;
Inventors:
Assignee:
Mitsui Chemicals, Inc., Minato-Ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/66 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); H01L 33/48 (2010.01); C08G 59/22 (2006.01); C09J 163/00 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C08G 59/38 (2013.01); H01L 2251/5315 (2013.01); C08L 2203/02 (2013.01); H01L 51/5237 (2013.01); C08G 59/226 (2013.01); C08L 63/00 (2013.01); C08G 59/66 (2013.01); C09J 163/00 (2013.01); C08G 59/4064 (2013.01);
Abstract
To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.