The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Oct. 12, 2012
Applicants:

Xiaolong MA, Beijing, CN;

Huaxiang Yin, Beijing, CN;

Zuozhen Fu, Beijing, CN;

Inventors:

Xiaolong Ma, Beijing, CN;

Huaxiang Yin, Beijing, CN;

Zuozhen Fu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/161 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 29/10 (2006.01); H01L 29/165 (2006.01); H01L 21/268 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66477 (2013.01); H01L 29/78 (2013.01); H01L 29/161 (2013.01); H01L 21/02381 (2013.01); H01L 21/02675 (2013.01); H01L 21/0245 (2013.01); H01L 21/02535 (2013.01); H01L 21/02452 (2013.01); H01L 21/02532 (2013.01); H01L 21/26506 (2013.01); H01L 21/268 (2013.01); H01L 29/517 (2013.01); H01L 29/665 (2013.01); H01L 29/66575 (2013.01); H01L 29/66651 (2013.01); H01L 29/66659 (2013.01); H01L 29/7848 (2013.01); H01L 29/1054 (2013.01); H01L 29/165 (2013.01);
Abstract

The present invention discloses a semiconductor device, comprising: a substrate, a gate stack structure on the substrate, source and drain regions in the substrate on both sides of the gate stack structure, and a channel region between the source and drain regions in the substrate, characterized in that at least one of the source and drain regions comprises a GeSn alloy. In accordance with the semiconductor device and method for manufacturing the same of the present invention, GeSn stressed source and drain regions with high concentration of Sn is formed by implanting precursors and performing a laser rapid annealing, thus the device carrier mobility of the channel region is effectively enhanced and the device drive capability is further improved.


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