The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Aug. 26, 2011
Applicants:

Joseph A. Yedinak, Mountaintop, PA (US);

Nathan L. Kraft, Pottsville, PA (US);

Inventors:

Joseph A. Yedinak, Mountaintop, PA (US);

Nathan L. Kraft, Pottsville, PA (US);

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/336 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 21/3065 (2006.01); H01L 29/40 (2006.01); H01L 29/739 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H02M 3/335 (2006.01); H01L 29/49 (2006.01); H01L 23/498 (2006.01); H01L 29/423 (2006.01); H01L 29/165 (2006.01); H01L 21/265 (2006.01); H02M 3/00 (2006.01); H01L 29/417 (2006.01); H02M 7/48 (2006.01); H01L 23/495 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 2924/01012 (2013.01); H01L 29/7811 (2013.01); H01L 29/7828 (2013.01); H01L 29/7805 (2013.01); H01L 2924/01019 (2013.01); H02M 3/33592 (2013.01); H01L 29/4933 (2013.01); Y02B 70/1475 (2013.01); H01L 2924/30105 (2013.01); H01L 29/0623 (2013.01); H01L 29/0661 (2013.01); H01L 29/66734 (2013.01); H01L 23/49816 (2013.01); H01L 29/7806 (2013.01); H01L 21/30655 (2013.01); H01L 29/7804 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/16 (2013.01); H01L 29/402 (2013.01); H01L 29/42368 (2013.01); H01L 29/165 (2013.01); H01L 29/7396 (2013.01); H01L 29/495 (2013.01); H01L 2924/3025 (2013.01); H01L 21/3065 (2013.01); H01L 2924/10253 (2013.01); H01L 21/26586 (2013.01); H01L 29/7815 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/13091 (2013.01); H01L 29/4236 (2013.01); H01L 29/0653 (2013.01); H01L 2924/15311 (2013.01); H01L 29/66348 (2013.01); H01L 2221/6834 (2013.01); H01L 29/0696 (2013.01); H01L 2924/1532 (2013.01); H02M 3/00 (2013.01); H01L 29/41766 (2013.01); H02M 7/48 (2013.01); H01L 29/0634 (2013.01); H01L 2924/01078 (2013.01); H01L 29/4238 (2013.01); H01L 23/4952 (2013.01); H01L 29/7813 (2013.01); H01L 21/6835 (2013.01); H01L 2924/3011 (2013.01); H01L 29/1095 (2013.01); H01L 29/7831 (2013.01); H01L 21/31116 (2013.01); H01L 29/7802 (2013.01);
Abstract

In one general aspect, a method can include forming a shield dielectric layer in a trench in a semiconductor substrate, forming a shield electrode on at least a portion of the shield dielectric layer, and etching the shield dielectric layer so that a portion of the shield dielectric layer is recessed in the trench. The method can include forming a gate dielectric layer on the recessed portion of the shield dielectric layer in the trench, forming a first conductive gate electrode on a first side of the shield electrode and insulated from a first sidewall of the trench by the gate dielectric layer, and forming a second conductive gate electrode on a second side of the shield electrode and insulated from a second sidewall of the trench by the gate dielectric layer.


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