The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Jun. 26, 2012
Applicants:

David B. Jackrel, Pacifica, CA (US);

Katherine Dickey, Stanford, CA (US);

Kristin Pollock, San Francisco, CA (US);

Jacob Woodruff, Mountain View, CA (US);

Peter Stone, Los Gatos, CA (US);

Gregory Brown, San Jose, CA (US);

Inventors:

David B. Jackrel, Pacifica, CA (US);

Katherine Dickey, Stanford, CA (US);

Kristin Pollock, San Francisco, CA (US);

Jacob Woodruff, Mountain View, CA (US);

Peter Stone, Los Gatos, CA (US);

Gregory Brown, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/032 (2006.01); H01L 31/0352 (2006.01); H01L 31/0749 (2012.01);
U.S. Cl.
CPC ...
H01L 31/0322 (2013.01); H01L 31/035218 (2013.01); Y02E 10/541 (2013.01); H01L 31/0749 (2013.01);
Abstract

Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.


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