The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Aug. 10, 2012
Applicant:

Takahiko Yoshizawa, Sakata, JP;

Inventor:

Takahiko Yoshizawa, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0232 (2014.01); G02B 5/20 (2006.01); H01L 29/06 (2006.01); G01J 3/02 (2006.01); H01L 31/0216 (2014.01); G02B 5/28 (2006.01); G01J 1/04 (2006.01); G01J 3/36 (2006.01); H01L 31/0352 (2006.01); G01J 3/12 (2006.01);
U.S. Cl.
CPC ...
G01J 3/0256 (2013.01); H01L 31/02327 (2013.01); G02B 5/201 (2013.01); B81B 2203/0384 (2013.01); G01J 2003/1213 (2013.01); H01L 29/06 (2013.01); H01L 31/02165 (2013.01); G02B 5/285 (2013.01); B81B 2201/047 (2013.01); G01J 1/0488 (2013.01); G01J 3/36 (2013.01);
Abstract

A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film, the first film having a first portion connected to the substrate, a second portion located above the sacrificial film, a third portion located between the first portion and the second portion, and a thin region in a portion of the third portion or in a boundary section between the second portion and the third portion and having a thickness smaller than the first portion; (c) removing the sacrificial film; and (d) bending the first film in the thin region, after the step (c), thereby sloping the second portion of the first film with respect to the substrate.


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