The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Oct. 13, 2005
Kanji Shimoosako, Kyotanabe, JP;
Takashi Ito, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Masaru Nishinaka, Otsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kanji Shimoosako, Kyotanabe, JP;
Takashi Ito, Otsu, JP;
Shigeru Tanaka, Settsu, JP;
Masaru Nishinaka, Otsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kaneka Corporation, Osaka, JP;
Abstract
A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 μm. The 90° anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin having a siloxane structure formed by polymerizing a diamine component having a structure represented by Formula (6) in a content of 5 to 95 mol % based on the entire diamine component. A sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material and laminate of the present invention is suitably applicable to manufacturing of a printed-wiring board and the like.