The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Dec. 02, 2011
Applicants:
Michael J. Walker, Shelby Township, MI (US);
Bob R. Powell, Jr., Birmingham, MI (US);
Inventors:
Michael J. Walker, Shelby Township, MI (US);
Bob R. Powell, Jr., Birmingham, MI (US);
Assignee:
GM Global Technology Operations LLC, Detroit, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/36 (2006.01); C23C 16/00 (2006.01); B21C 37/00 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C23F 1/02 (2006.01); B22D 19/08 (2006.01); C23C 6/00 (2006.01);
U.S. Cl.
CPC ...
B22D 19/08 (2013.01); C23C 6/00 (2013.01); Y10S 977/89 (2013.01); Y10S 977/891 (2013.01); Y10S 977/762 (2013.01); Y10S 977/781 (2013.01);
Abstract
A method of bonding a metal to a substrate is disclosed herein. The method involves forming a nano-brush on a surface of the substrate, where the nano-brush includes a plurality of nano-wires extending above the substrate surface. In a molten state, the metal is introduced onto the substrate surface, and the metal surrounds the nano-wires. Upon cooling, the metal surrounding the nano-wires solidifies, and during the solidifying, at least a mechanical interlock is formed between the metal and the substrate.