The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Jul. 09, 2008
Applicants:

Siddhartha Bhowmik, Salem, OR (US);

Swaroop K. Kommera, Corvallis, OR (US);

Manish Giri, Corvallis, OR (US);

Robert N. K. Browning, Corvallis, OR (US);

Charles Gustav Schmidt, Corvallis, OR (US);

Inventors:

Siddhartha Bhowmik, Salem, OR (US);

Swaroop K. Kommera, Corvallis, OR (US);

Manish Giri, Corvallis, OR (US);

Robert N. K. Browning, Corvallis, OR (US);

Charles Gustav Schmidt, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1601 (2013.01); B41J 2/14145 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1634 (2013.01);
Abstract

A print head die () includes slot ribs () having edges () with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side () of a wafer () a series of spaced openings () completely through the wafer () and separated by ribs () followed by wet etching the wafer () from a second opposite side () to recess the ribs () from the second side ().


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