The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Nov. 07, 2012
Applicant:

Samsung Electro-mechanics, Co., Ltd., Gyunggi-do, KR;

Inventors:

Seok Joon Hwang, Gyunggi-do, KR;

Je Jung Kim, Gyunggi-do, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 4/005 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); H01G 4/005 (2013.01); H01G 4/30 (2013.01);
Abstract

There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented.


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Hwang, Seok. (2014). Multilayered ceramic electronic component and fabricating method thereof (U.S. Patent No. 8885323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8885323

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