The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Dec. 07, 2010
Applicants:
Ji Eun Son, Paju-si, KR;
Kyung Sik Dan, Goyang-si, KR;
SE Min Lee, Paju-si, KR;
Min Jin Lee, Paju-si, KR;
Inventors:
Ji Eun Son, Paju-si, KR;
Kyung Sik Dan, Goyang-si, KR;
Se Min Lee, Paju-si, KR;
Min Jin Lee, Paju-si, KR;
Assignee:
LG Display Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 5/00 (2006.01); H05K 1/02 (2006.01); F21V 8/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/0083 (2013.01); H05K 1/0281 (2013.01); H05K 2201/10106 (2013.01); H05K 1/189 (2013.01); H05K 3/0061 (2013.01); H05K 1/0207 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09681 (2013.01);
Abstract
A flexible printed circuit board (FPCB) capable of improving strength is disclosed, the FPCB comprising a base film; a copper layer on the base film, the copper layer including a circuit pattern, and a strength-reinforcing pattern in an area without the circuit pattern; and a coverlay film on the copper layer.