The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Mar. 26, 2012
Applicants:

Kenji Hirohata, Tokyo, JP;

Minoru Mukai, Tokyo, JP;

Tomoko Monda, Kanagawa-ken, JP;

Inventors:

Kenji Hirohata, Tokyo, JP;

Minoru Mukai, Tokyo, JP;

Tomoko Monda, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Zand the impedance Zsatisfy a following relationship (1),


Find Patent Forward Citations

Hirohata, Kenji. (2014). Semiconductor module (U.S. Patent No. 8884634). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8884634

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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