The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Sep. 13, 2012
Applicant:
Jin Hui Lee, Seoul, KR;
Inventor:
Jin Hui Lee, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01); H01L 21/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 2924/15311 (2013.01); H01L 2225/06593 (2013.01); H01L 2225/06565 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/73204 (2013.01); H01L 25/50 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06541 (2013.01); H01L 25/0657 (2013.01); H01L 2224/81141 (2013.01); H01L 23/544 (2013.01);
Abstract
A semiconductor chip includes a substrate having one surface and an other surface which substantially faces away from the one surface; at least two alignment bumps formed on the one surface of the substrate and having different diameters; and at least two alignment grooves defined on the other surface of the substrate and having different diameters.