The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Aug. 09, 2011
Jochen Kraft, Oberaich, AT;
Stefan Jessenig, Graz, AT;
Günther Koppitsch, Lieboch, AT;
Franz Schrank, Graz, AT;
Jordi Teva, Graz, AT;
Bernhard Löffler, Gleisdorf, AT;
Jörg Siegert, Graz, AT;
Jochen Kraft, Oberaich, AT;
Stefan Jessenig, Graz, AT;
Günther Koppitsch, Lieboch, AT;
Franz Schrank, Graz, AT;
Jordi Teva, Graz, AT;
Bernhard Löffler, Gleisdorf, AT;
Jörg Siegert, Graz, AT;
ams AG, Unterpremstaetten, AT;
Abstract
Through the intermetal dielectric () and the semiconductor material of the substrate () a contact hole is formed, and a contact area of a connection metal plane () that faces the substrate is exposed in the contact hole. A metallization () is applied, which forms a connection contact () on the contact area, a through-contact () in the contact hole and a connection contact () on a contact area facing away from the substrate and/or on a vertical conductive connection () of the upper metal plane ().