The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
May. 10, 2013
Applicant:
Futurewei Technologies, Inc., Plano, TX (US);
Inventors:
Anwar A. Mohammed, San Jose, CA (US);
Vadim Gektin, San Jose, CA (US);
Assignee:
FutureWei Technologies, Inc., Plano, unknown;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 25/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 25/00 (2013.01); H01L 25/50 (2013.01);
Abstract
Lower semiconductor dies in 2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above the interposer or beneath the substrate. The thermal coupling can be achieved using heat pipes, thermal vias, or other conductive passage ways.