Method for manufacturing a microelectronic package comprising at least one microelectronic device

Abstract

A method for manufacturing a microelectronic package () comprises the steps of providing at least two members () comprising electrically conductive material; providing a microelectronic device (); placing the electrically conductive members () and the microelectronic device () in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members () and the microelectronic device (); and providing a non-conductive material for encapsulating the microelectronic device () and a portion of the electrically conductive members () connected thereto. The electrically conductive members () are intended to be used for realizing contact of the microelectronic device () arranged inside the package () to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members () as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of material during its manufacturing process.