The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Sep. 13, 2011
Applicants:
Yingying Lou, Shanghai, CN;
Tiesheng LI, San Jose, CA (US);
Yu Wang, Fremont, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Inventors:
Yingying Lou, Shanghai, CN;
Tiesheng Li, San Jose, CA (US);
Yu Wang, Fremont, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Assignee:
Alpha & Omega Semiconductor Ltd, Hamilton, BM;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/312 (2006.01); H01L 29/66 (2006.01); H01L 21/66 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 29/407 (2013.01); H01L 29/66734 (2013.01);
Abstract
A semiconductor device wafer includes a test structure. The test structure includes a layer of material having an angle-shaped test portion disposed on at least a portion of a surface of the semiconductor wafer. A ruler marking on the surface of the semiconductor wafer proximate the test portion is adapted to facilitate measurement of a change in length of the test portion.