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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8884343 B1

PDFFull Text
Date of Patent:
Nov. 11, 2014

Filed:

Feb. 19, 2013

System in package and method for manufacturing the same

Applicant:

Texas Instruments Deutschland, Freising, DE;

Inventors:

Bernhard Lange, Freising, DE;

Juergen Neuhaeusler, Bad Aibling, DE;

Assignee:

Texas Instruments Incorporated, Dallas, TX (US);

Attorneys:

Steven A. Shaw

Frederick J. Telecky, Jr.

Primary Examiner:

David Nhu

Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 21/50 (2006.01); H01L 23/051 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/051 (2013.01); H01L 24/32 (2013.01); H01L 24/29 (2013.01); H01L 2224/05655 (2013.01); H01L 23/48 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/29339 (2013.01); H01L 25/072 (2013.01); H01L 25/071 (2013.01); H01L 2224/73267 (2013.01); H01L 24/73 (2013.01); H01L 23/5389 (2013.01); H01L 24/83 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/0346 (2013.01); H01L 24/33 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/04026 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/13091 (2013.01); H01L 24/24 (2013.01); H01L 2224/24227 (2013.01);
Abstract

A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is embedded in the laminate body and the semiconductor is bonded to contact pads of the substrate by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.

Find Patent Forward Citations

Lange, Bernhard. (2014). System in package and method for manufacturing the same (U.S. Patent No. 8884343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8884343

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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