The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Dec. 06, 2012
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Wen-Hsiung Chen, New Taipei, TW;
Yu-Tsan Cheng, New Taipei, TW;
Wen-Chang Chen, New Taipei, TW;
Shu-Sheng Peng, Shenzhen, CN;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.