The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Apr. 09, 2014
Rohm Co., Ltd., Kyoto, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Tadahiro Morifuji, Kyoto, JP;
Haruo Shimamoto, Kanagawa, JP;
Chuichi Miyazaki, Kanagawa, JP;
Toshihide Uematsu, Kanagawa, JP;
Yoshiyuki Abe, Kanagawa, JP;
Rohm Co., Ltd., Kyoto, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
Grooves are formed on the front surfaces of first and second semiconductor wafers each including an aggregate of a plurality of semiconductor chips. The grooves each extend on a dicing line set between the semiconductor chips and to have a larger width than the dicing line. Thereafter the first and second semiconductor wafers are arranged so that the front surfaces thereof are opposed to each other, and the space between the first semiconductor wafer and the second semiconductor wafer is sealed with underfill. Thereafter the rear surfaces of the first and second semiconductor wafers are polished until at least the grooves are exposed, and a structure including the first and second semiconductor wafers and the underfill is cut on the dicing line.