The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Sep. 26, 2008
Applicants:

Yi-qun LI, Danville, CA (US);

Yi Dong, Tracy, CA (US);

Inventors:

Yi-Qun Li, Danville, CA (US);

Yi Dong, Tracy, CA (US);

Assignee:

Intematix Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/44 (2010.01); B29C 39/02 (2006.01); B29C 39/10 (2006.01); H01L 33/50 (2010.01); B29C 39/00 (2006.01); H01L 33/00 (2010.01); H01J 1/62 (2006.01); H01J 63/04 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 33/44 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01); B29C 39/025 (2013.01); B29C 39/10 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/0041 (2013.01); H01L 2224/73265 (2013.01); B29C 39/006 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/32245 (2013.01); B29L 2011/00 (2013.01);
Abstract

A method of fabricating a light emitting device comprises: mounting a light emitting diode chip in a package; heating the light emitting diode chip package assembly to a pre-selected temperature; and dispensing a pre-selected volume of a mixture of at least one phosphor and a light transmissive thermosetting material (silicone, epoxy) on a surface of the chip. The pre-selected volume and temperature are selected such that the phosphor/material mixture flows over the entire light emitting surface of the chip before curing. In an alternative method, using a light transmissive UV curable material such as an epoxy, the phosphor/material mixture is irradiated with UV radiation after a pre-selected time to cure the material. The pre-selected volume and pre-selected time are selected such that the phosphor/material mixture flows over at least the light emitting surface of the chip before curing.


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