The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Jan. 02, 2014
Canon Kabushiki Kaisha, Tokyo, JP;
Tetsushi Ishikawa, Tokyo, JP;
Tamaki Sato, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A process for producing a liquid ejection head including, on a substrate, a flow path forming member forming ejection orifices and a liquid flow path communicating therewith, including forming, on the substrate, a first layer of photosensitive resin; forming, on the first layer, a mask layer in which at least part of a side surface thereof has a light transmission distribution with a material capable of reducing transmission of light having a photosensitive wavelength of the resin; performing, for the first layer, exposure with the mask layer and development to form a flow path mold pattern having a taper angle θ satisfying 95°<θ, where θ is the angle between top and side surfaces in cross section of the pattern perpendicular to substrate surface; forming a coating resin layer to cover the pattern; patterning the resin layer to form the member; and removing the pattern to form the flow path.