The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Dec. 07, 2010
Applicants:

Tomotsugu Miyabe, Otsu, JP;

Yoji Fujita, Otsu, JP;

Inventors:

Tomotsugu Miyabe, Otsu, JP;

Yoji Fujita, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); C08L 79/08 (2006.01); C08G 73/10 (2006.01); G03F 7/075 (2006.01); C08K 5/29 (2006.01); C08K 5/5425 (2006.01); C08K 5/5435 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 73/10 (2013.01); G03F 7/0233 (2013.01); G03F 7/0751 (2013.01); C08K 5/29 (2013.01); C08K 5/5425 (2013.01); C08K 5/5435 (2013.01);
Abstract

Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350° C. or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.


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