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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8883318 B1

PDFFull Text
Date of Patent:
Nov. 11, 2014

Filed:

Oct. 25, 2010

Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy

Applicants:

Shinji Yamamoto, Suita, JP;

Masaaki Ishio, Suita, JP;

Inventors:

Shinji Yamamoto, Suita, JP;

Masaaki Ishio, Suita, JP;

Assignee:

Neomax Materials Co., Ltd., Osaka, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

John J Zimmerman

Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 15/01 (2006.01); B23K 1/19 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 20/227 (2006.01); B23K 20/233 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); C22C 19/00 (2006.01); C22C 19/03 (2006.01);
U.S. Cl.
CPC ...
B23K 1/19 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); B23K 20/2275 (2013.01); B23K 20/2333 (2013.01); B23K 20/2336 (2013.01); B23K 35/002 (2013.01); B23K 35/004 (2013.01); B23K 35/0233 (2013.01); B23K 35/3033 (2013.01); B32B 15/015 (2013.01); B32B 15/017 (2013.01); C22C 19/007 (2013.01); C22C 19/03 (2013.01); B23K 2201/40 (2013.01); B23K 2203/10 (2013.01); B23K 2203/18 (2013.01); B23K 2203/20 (2013.01);
Abstract

An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.

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Yamamoto, Shinji. (2014). Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy (U.S. Patent No. 8883318). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8883318

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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