The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Aug. 10, 2011
Applicants:

Tae-joon Kim, Yongin, KR;

Sang-hee Lee, Yongin, KR;

Inventors:

Tae-Joon Kim, Yongin, KR;

Sang-Hee Lee, Yongin, KR;

Assignee:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/189 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/061 (2013.01); H05K 2203/049 (2013.01);
Abstract

A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.


Find Patent Forward Citations

Loading…