The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Dec. 10, 2012
Applicant:
Microsoft Corporation, Redmond, WA (US);
Inventors:
David Mandelboum, Rakefet, IL;
Giora Yahav, Haifa, IL;
Asaf Pellman, Beit Yehoshua, IL;
Shlomo Felzenshtein, Nesher, IL;
Assignee:
Microsoft Corporation, Redmond, WA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); G01S 17/89 (2006.01); F21V 13/02 (2006.01); H05K 1/02 (2006.01); G02B 27/20 (2006.01); F21V 21/00 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); G01S 17/89 (2013.01); H01S 5/02296 (2013.01); H01S 5/024 (2013.01); F21V 13/02 (2013.01); H01S 5/02276 (2013.01); H05K 1/0296 (2013.01); G02B 27/20 (2013.01); H01S 5/4031 (2013.01); H01S 5/02288 (2013.01); H01L 5/06209 (2013.01); H01S 5/02212 (2013.01); H01S 5/02236 (2013.01); H01S 5/022 (2013.01);
Abstract
An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.