The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Aug. 29, 2008
David Van Heerden, Baltimore, MD (US);
Ramzi Vincent, Columbia, MD (US);
Timothy Ryan Rude, Salt Lake City, UT (US);
David Van Heerden, Baltimore, MD (US);
Ramzi Vincent, Columbia, MD (US);
Timothy Ryan Rude, Salt Lake City, UT (US);
NanoFoil Corporation, Utica, NY (US);
Abstract
A method for bonding an LED assembly () or other electronic package () to a substrate PCB containing a heat-sink (), which utilizes layers of reactive multilayer foil () disposed between contacts () of the electronic packageand the associated contact pads () on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (), together with an application of pressure, sufficient heat is generated between the contacts () and the associated contact pads () to melt adjacent bonding material () to obtain good electrically and thermally conductive bonds between the contactsand contact pads () without thermally damaging the electronic package (), heat-sensitive components () associated with the electronic package (), or other the supporting substrate PCB.